The Interconnection Specialists, Selwyn Electronics are pleased to offer an extensive range of Ball Grid Array (BGA) socket and adaptor systems.
From 1.27mm down to 0.3mm pitch versions and solutions for terminating BGA, LGA, QFN, LCC and QFP devices, Selwyn can offer an economical method of device validation and development where soldering the device to the PCB is not practical.
Alongside the low insertion force socketing systems, is range of adaptors onto which the device can be soldered and then loaded into a socket or pinned out to a custom footprint, this also subjects the device to a lower thermal stress level than soldering direct to a PCB.
If you can provide the details of your device, we can provide a socket/adaptor solution for you.
Telephone 01732 765100
Website: www.selwyn.co.uk
Email: interconnect@selwyn.co.uk
