Enabling high-speed swept-source OCT with advanced data acquisition
Optical coherence tomography (OCT) has become an essential tool in modern medical imaging. By...
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Microelectronics US 2026 Opens Its Doors in One Week, Bringing Engineering Leaders to Austin to Tackle the Challenges Defining Next-Generation Systems
With just over a week to go, Microelectronics US 2026 is set to open on April 22 at the Palmer...
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OMRON publishes product carbon footprint data ahead of new sustainability rules
OMRON Electronic Components Europe is scaling product carbon footprint (PCF) reporting across its...
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Synopsys Solutions support NASA’s Artemis program with spacesuit analysis and communication system development
NASA selected Synopsys, Inc. and EMA to verify spacesuit compatibility with the lunar environment....
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Loftware introduces Loftware Connect, establishing a new standard for connected supply chains
Loftware today announced the launch of Loftware Connect, a transformative new platform that...
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Optical link requirement reflects broader trend for increased use of fibre optic technologies in high voltage applications
Designer & manufacturer of industrial fibre-optic datalinks and optical cable assemblies, OMC,...
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Carfulan Group to showcase three ‘UK firsts’ and two ‘MACH debuts’ as it promises to shape the future of manufacturing
Carfulan Group is heading to MACH 2026 later this month with its biggest ever collection of...
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World IoT Day: Engineers warn many IoT devices still face cellular migration hurdles
To mark World IoT Day on 9 April, embedded electronics consultancy ByteSnap Design has released...
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CEA-Leti, CEA-List and PSMC collaborate to integrate RISC-V and MicroLED Silicon Photonics for next-generation AI
Micro & nanotechnologies research institute, CEA-Leti, and specialist in smart digital...
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Newly Launched Extech.com Website Brings the Full Extech Lineup to a Dedicated Online Home
Extech, a Teledyne Flir brand, today announced the launch of Extech.com, a refreshed, dedicated...
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CAMTEC Power Supplies expands its unique SIC-MOSFET DIN RAIL power supply EC-Series to 2000W
With its new CPS-EC2000 AC/DC power supply series, CAMTEC Power Supplies once again sets a...
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Solderstar appoints Scanditron as Nordic and Baltic distribution partner
Solderstar, has appointed Scanditron as its official distribution partner across the Nordic and...
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element14 Community launches global celebration for women in STEM
element14, an Avnet Community, has launched INSPIRE HER FUTURE, a global celebration recognising...
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Zel components launches platform to expand certified component distribution in Europe
Alternative electronic parts supplier, Zel Components has launched a new platform to improve how...
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Emerson Launches New, Easily Configurable Welding Platform, Fully Adaptable to Evolving Manufacturing Needs
Emerson has launched the new BransonTM Polaris Ultrasonic Welding Platform, a highly configurable...
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Farnell strengthens global linecard with Same Sky’s specialised interconnect, audio and thermal Solutions
Farnell has signed a worldwide distribution agreement with Same Sky, a manufacturer specialising...
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QSMP-20 module utilises DDR3 memory to avoid ongoing AI pressure on lead times and cost
Direct Insight, the UK-based technical systems integrator focused on system-on-module solutions,...
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Vertiv partners with Yokogawa for AI-ready UPS systems validation
Artificial Intelligence has fundamentally altered power dynamics within data centres. Unlike...
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Fast, compact and lightweight IP67 Coolant Temperature Sensors
Inelco Hunter, a franchised distributor for Amphenol, is pleased to confirm availability of...
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Teledyne SP devices introduces high-speed disk streaming with ADQ35 and libads for extreme data capture
Teledyne SP Devices recently announced a major advancement in high‑speed data acquisition through...
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S Jones Conversions returns to The Fire Safety Event 2026
S Jones Conversions, the specialist container conversion division of S Jones Containers, is set to...
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Farnell engages engineers with hands-on Edge AI innovation at Embedded World 2026
Farnell EMEA welcomed engineers from across the global electronics industry at Embedded World...
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iconsys launches dedicated industrial cyber security solution
iconsys, which has delivered over 5,000 automation projects across heavy industry, marine,...
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Würth Elektronik presents a new power inductor for automotive electronics: Ultra-low losses and highest current capability
With the WE-MXGA inductor Würth Elektronik presents an AEC-Q200-certified component qualified for...
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OMRON high-current DC relays deliver efficient, space-saving isolation for utility storage and charging infrastructure
OMRON Electronic Components Europe has introduced convenient PCB-mount relays for safety isolation...
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The best things come in small packages as RoboTrex Compact set to make UK debut at MACH 2026
A ‘UK’ first will be unveiled at MACH 2026 when Lang Technik UK delivers its latest space-saving...
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Wireless modules for embedded systems now available from Tria Technologies
Tria Technologies, an Avnet company specialising in embedded compute boards, systems and HMIs, has...
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EPC introduces the EPC91121 BLDC motor drive evaluation board using EPC’s seventh-generation GaN technology at APEC 2026
At APEC 2026, Efficient Power Conversion (EPC), is introducing the EPC91121 motor drive inverter...
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Yokogawa Test & Measurement introduces new isolation and power modules with greater DC offset capabilities and waveform accuracy
Yokogawa Test & Measurement Corporation announces its new 720252 1 MS/s 16-bit isolation...
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Lane Electronics appoint Callon O’Keeffe as business development administrator
Lane Electronics a franchised distributor for many of the industry’s major electrical, electronic...
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