With the latest advances in power saving technology, Young Electronics Group is pleased to announce the release of four new Bluetooth® 4.0 low profile wireless transceiver modules from Fujitsu Components which compliments their existing range of Bluetooth® and Wireless LAN Modules. Ideal for applications such as mobile terminals, remote controlled devices and other battery powered equipment. These modules conform to the new Bluetooth® low energy standard 4.0 offering substantial improvements in energy consumption over the earlier Bluetooth® standards and are available with (MBH7BLZ02) or without (MBH7BLZ01) an integrated antenna. The new modules offer a compact size 12.4 x 9.4 x 1.6mm without antenna and 17.6 x 10.6 x 1.8mm with antenna, both surface mounted. Fujitsu’s Bluetooth® 4.0 Low Energy modules provide secure wireless communication with any Bluetooth® Smart ready device.
The modules are based on Nordic Semiconductor’s nRF51822 integrated circuit and are available either with upper layer protocol stack and profiles embedded for convenient integration of Bluetooth® Low Energy, or a user definable type where the built-in 32 bit ARM® CortexTM M0 processor allows the adding of upper layer profiles including ‘private’ profiles and application code. By using the development tools available from Nordic Semiconductor, it is possible to implement specific processing into the module and compose functions without using an additional MCU The module contains the complete verified and qualified Bluetooth® Low Energy protocol stack offering flexibility and a high level of customisation. It therefore provides the perfect solution to reduce product size, cost and design complexity and therefore the time to market is minimised with the obvious cost savings that come with that.
The modules offered by YEG include a crystal oscillator and are compatible with UART, SPI, I2C and GPIO interfaces. The low power consumption can be expressed in the following data; in sleep mode power consumption is 3µA, in TX Mode, 10.5mA and in RX Model 13mA. The modules require a supply voltage of between 2.1V up to 3.6V and a transmit power of maximum +4dBm whilst the receiver sensitivity is typically -91dBm.
YEG are able to offer an evaluation kit which consists of an evaluation board, a debugger board and a USB dongle to emulate another device. A daughter board is also required which is available separately from the evaluation kit. Customers can download a new Bluetooth® qualified protocol stack including GAP, GATT, SM, L2CAP and a software development kit (“SDK”) from Nordic Semiconductor website www.nordicsemi.com. Users will be required to register and a product key is required for free download which is provided with the evaluation kit. In addition to this YEG are able to offer a software writing service (chargeable) as well as aiding the optimization of antenna characteristics to further simplify the development process
Bluetooth® LE is a hallmark of the latest release of Bluetooth® wireless technology and is a pre-requisite for Bluetooth® Smart products. Such products are able to interoperate with the latest generation of Bluetooth® Smart Ready handsets and tablets now being offered by major consumer electronics companies. As you can see from the above, YEG are willing and able to help with your development of products to join in with this exciting development in consumer and industrial wireless control and information transfer.
More information on the range can be seen on the YEG’s specialist components website at: www.yegcomponents.co.uk or contact:
Andrew Philips – Divisional Manager
Young Electronics Group
Tel: 01494 753500
