Digital infrastructure company Vertiv has launched three new cooling chip products which will be showcased for the first time at EMEA next week.
The new models, the Vertiv CoolChip CDU 70, Vertiv CoolChip CDU 100 and the Vertiv CoolChip CDU 600 are designed to suit retrofit or greenfield data centre environments, with liquid-to-liquid and liquid-to-air technologies and in-row and row based configurations.
Vertiv CoolChip CDU 70 is an in-row, liquid-to-air coolant distribution unit that enables a fast, cost-effective entry into liquid cooling for data centres retrofitting existing environments or deploying new infrastructure. The system delivers up to 70 kW of cooling capacity and is designed for agility and scalability, helping to reduce secondary fluid network complexity and infrastructure footprint. Its integrated controller supports real-time monitoring, group control and unit-to-unit communication, for coordinated thermal performance, simplified management, and efficient scaling across multiple racks.
Vertiv CoolChip CDU 100 brings powerful liquid-to-liquid in-rack cooling performance, giving data centres a secure and space-efficient solution for high-density workloads. Ideal for operators to introduce or expand liquid cooling deployments one rack at a time, supporting incremental growth or AI pilot programs without the need for large-scale infrastructure changes. With 100 kW of cooling capacity in a 4U form factor and a large-surface heat exchanger engineered for low approach temperatures, Vertiv CoolChip CDU 100 enables optimal heat transfer. An integrated controller provides monitoring and control capabilities to streamline operations and enhance visibility. Built-in filtration and precise temperature control within ±1°C help maintain fluid quality and thermal stability, while the physical separation of facility and IT loops supports secure, efficient system management in mission-critical environments.
Vertiv CoolChip CDU 600 is an in-row, liquid-to-liquid model delivering robust, scalable liquid cooling capacity for high-density AI and HPC deployments. The 600 kW system is designed to meet the demands of hyperscale and colocation environments, supporting in-row configurations and integrating easily into raised floor or retrofit installations. Its design, including top or bottom piping connections and available internal manifolds, streamlines infrastructure planning and speeds implementation. With redundant pumps, advanced monitoring for temperature and fluid quality, and a flexible approach to deployment, Vertiv CoolChip CDU 600 offers reliability, visibility, and performance for customers scaling liquid cooling across broader IT environments.
Sam Bainborough, vice president, EMEA thermal business at Vertiv said. “As workloads continue to drive higher rack densities and cooling demands, customers need liquid cooling solutions that adapt to their unique deployment strategies, whether retrofitting an existing environment or scaling a new build. The Vertiv CoolChip CDU family offers flexible, scalable solutions that simplify deployment and support long-term growth. By reducing integration complexity and adapting to a range of data centre environments, these CDUs help organisations scale liquid cooling more efficiently.”
For more information on the Vertiv CoolChip CDU family visit Vertiv.com.
