A family of low-power, precision temperature sensors targeted at Double Data Rate 2 and 3 (DDR2 and DDR3) memory modules, Solid State Drives (SSD), and computing motherboards has been released by Integrated Device Technology, Inc.
The digital thermal sensors support both a 3.3V and lower-power 2.5V SM-Bus and I2C interface for improved system power efficiency and compatibility with both existing and emerging serial bus controllers.
Advanced on-die power management features minimise power consumption during critical modes, such as when mobile or fault-tolerant enterprise systems are operating on battery power.
The new product family includes a stand-alone temperature sensor (TS30 -00GB2), as well as one with an integrated 256-byte EEPROM array (TSE2002GB2) on a single, monolithic die for non-volatile storage of user information, such as system configuration data for the Serial Presence Detect (SPD) feature of the memory module device.
The products provide ±1°C temperature sensing accuracy over the temperature range of -20°C to 125°C. In addition, a high-performance analogue-to-digital converter (ADC) enables up to 12-bit (0.0625°C) programmable resolution with conversion time that improves precision across the full temperature range.
