Structalit® 5610T is a new one component fast curing epoxy adhesive from manufacturers Panacol. This heat cure adhesive is specially designed for bonding Surface Mounted Devices (SMDs) on to printed circuit boards (PCBs). Due to its high viscosity the adhesive is well-suited for screen printing.

Before soldering, chips or SMDs are often attached to the PCB with UV-curing adhesive. This allows, for example, several chips or other components to be glued onto on a circuit board within just a few seconds to prevent their falling or sliding out of position on the PCB. The secured chips can then be reflow-soldered in a single work step, which saves time and speeds up production.

Panacol’s structural adhesives for SMD assembly have been specifically developed to cure rapidly on exposure to heat or under UV light and provide strong adhesion. Once cured, the adhesives are short-term heat-resistant and therefore suitable for holding components before and during reflow soldering onto PCBs.

Structalit® 5610 PCB component glue is a red-coloured epoxy which contrasts well against green circuit boards. The one-component adhesive is easily applied via dispenser, screen printing or needle transfer.

Perfect Adhesive for Reflow Soldering

The SMD adhesive cures thermally within minutes, even at low temperatures. At the same time it is highly temperature-resistant: Temporarily it can be exposed to temperatures up to 280° C, making it the perfect adhesive for reflow soldering.

Typical curing temperatures are:

  • 1 minute at 150°C
  • 3 minutes at 120°C
  • 5 minutes at 110°C

 

The final strength of the adhesive is reached at the earliest after 24 hours. Once cured, Structalit® 5610 is extremely shock-resistant and features very high adhesion to FR4 PCBs made of glass-reinforced epoxy laminate material, to metals and to epoxy-based mould materials.

On request these PCB adhesives are also available with fluorescent pigment to facilitate quality and application monitoring. Their red colour or fluorescence makes the adhesive clearly visible to allow the bond quality of every component to be easily inspected also in mass production.

Contact technical@techsil.co.uk for a datasheet or visit www.techsil.co.uk