Following the launch of Qualcomm Dragonwing IQ-2390, SECO today expands its portfolio with Compact Vision 5 Dragonwing IQ-2390, a 5-inch industrial HMI, and SBC-Dragonwing-IQ-2390, a compact single-board computer built on the new platform. The two solutions are designed to modernise connected industrial devices across HMI, control, vending, building automation, industrial vision and other compact embedded applications.
Supporting the modernisation of established industrial systems
Industrial OEMs increasingly need to introduce richer user interfaces, integrated connectivity, local intelligence and secure software lifecycle management without completely redesigning established products. For those modernising established embedded platforms, including HMI and control systems, SECO’s solutions powered by Dragonwing IQ-2390 provide a path toward higher compute performance, on-device AI, crisp 3D graphics, integrated wireless connectivity and more efficient software and device lifecycle management.
Compact Vision 5 Dragonwing IQ-2390 and SBC-Dragonwing-IQ-2390 address these requirements through two complementary formats: a ready-integrated industrial HMI and a flexible single-board computer for custom embedded designs.
A new foundation for compact industrial systems
Dragonwing IQ-2390 is designed to bring high-performance CPU processing, vision, AI acceleration, real-time control and industrial networking together on a single platform for HMI, industrial vision and control applications. By integrating an ISP, on-device AI, a RISC-V MCU, dual Gigabit Ethernet with TSN, and an audio DSP, the processor aims to reduce the number of external components in compact industrial designs, simplifying board layout, power management, and system integration.
Designed for compact HMIs, smart controllers, vending systems, medical handhelds, access-control devices and vision-enabled equipment, the platform combines modern connectivity, low-power operation, industrial-grade reliability, long-lifecycle support and right-sized on-device AI for cost-sensitive designs. SECO complements the processor with Clea OS and the broader Clea framework, providing an integrated software foundation for the development, deployment, and lifecycle management of connected industrial products.
An industrial HMI and SBC for different integration needs
Compact Vision 5 Dragonwing IQ-2390 is a 5-inch HMI panel designed for machine operators and industrial control applications that require modern touch interaction, industrial reliability and entry-level on-device AI. Its key features include:
- 5-inch touchscreen with IP65 front protection;
- 2 GB or 4 GB of RAM and 16 GB of eMMC storage;
- RS232, RS485, CAN, Gigabit Ethernet, USB-C, Wi-Fi, and Bluetooth;
- 9-to-24 V DC power input;
Additional 4.3-inch and 7-inch versions are planned to complete the offer.
SBC-Dragonwing-IQ-2390 provides the same processing, memory, and connectivity foundation in a compact single-board computer for customised embedded systems. In addition to industrial serial interfaces, CAN, Gigabit Ethernet, USB-C, Wi-Fi and Bluetooth, it includes an expansion port supporting camera, audio, Ethernet, USB and I2C/I3C connectivity.
A market-specific version of SBC-Dragonwing-IQ-2390, featuring an extension board and supported by the upcoming Clea OS 3.0, is designed to help teams extend prototyping into industrial product architectures. The approach combines SECO’s industrial hardware, software lifecycle support and development resources.
The AI Audio Dongle is also available as an optional USB-connected accessory for both Compact Vision 5 Dragonwing IQ-2390 and SBC-Dragonwing-IQ-2390, featuring a microphone array in a 3+3 configuration, beamforming, and a speaker to support reliable voice interaction in noisy environments. It helps OEMs add advanced voice interfaces to existing HMI platforms while limiting integration complexity.
Clea OS and software lifecycle management
Both products run Clea OS 2.0 and will support the upcoming Clea OS 3.0. Clea OS, SECO’s secure embedded operating system, enables software updates and device manageability throughout the product lifecycle. SECO’s BSP and development resources help simplify software migration from evaluation to production, while the SECO Developer Center and Application Hub provide access to technical resources and Edge AI applications.
“The future of industrial innovation depends on making advanced technologies accessible. Industrial OEMs need a practical way to modernise existing products without increasing complexity or cost. With Compact Vision 5 Dragonwing IQ-2390 and SBC-Dragonwing-IQ-2390, we provide two complementary paths built on the same Dragonwing IQ-2390 foundation,” said Lorenzo Veltroni, Chief Product and Marketing Officer at SECO. “Combined with Clea OS, these solutions enable customers to modernise and enhance existing industrial products with advanced user experiences, reliable connectivity, long-term software lifecycle management, and entry-level Edge AI capabilities. The result is a scalable, industrial-grade platform that accelerates innovation while maintaining a controlled cost structure.”
“We are excited to expand our collaboration with SECO through these new platforms powered by the Dragonwing IQ-2390 processor. Built for modern industrial applications, the Dragonwing IQ-2390 aims to combine powerful computing, AI, 3D graphics, and real-time control together in a single power-efficient platform,” said Eric Mazzoleni, VP, Industrial IoT and Robotics Europe Sales at Qualcomm Germany GmbH. “Together with SECO’s hardware and software expertise, we are working to provide the foundation to modernise legacy industrial systems and deploy intelligent edge computing at scale – empowering OEMs to build next-gen HMIs, gateways, PLCs, and machine vision systems.”
Register for early access
Interested OEMs and engineering teams can register here for early access to Compact Vision 5 Dragonwing IQ-2390 and SBC-Dragonwing-IQ-2390, receiving updates on evaluation opportunities and product availability.
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