Robnor Resins TCP091 is a silicone-free paste specially formulated to provide efficient and reliable heat transfer across the interface between electronic components or heat dissipation between any surfaces required without the migration or contamination associated with silicone-based products. TCP091 has been developed to optimise performance with an easy application and excellent viscosity which helps prevent slumping.
This general purpose thermal management paste is a virtually “no-bleed”, high-performance compound that will not dry out, harden, melt, or run, even after long-term continuous exposure to temperatures up to 130°C.
When compared to its nearest competitor TCP091 is far superior product when it comes to the following:
· More stable
· Very low separation in the syringe
· Better flowability
· Easier to process
· Better self life
Key properties
- Good thermal conductivity
- Non Silicone
- Excellent flow – thixotropic (Non Slumping) yet still has flow through a small nozzle with minimum effort.
- Excellent resistance to mould growth.
- Excellent dielectric properties at all frequencies
- Non-corrosive to Cadmium and Zinc plate
- Operating temperature range –50 to +130°C
REACH & ROHS compliant: Contains NO SVHC’s.
TCP091 is available to in 10ml & 30ml syringes and 1kg & 25kg bulk containers.
