Qualcomm Incorporated and TDK Corporation announced an agreement to form a joint venture to deliver RF front-end (RFFE) modules and RF filters into fully-integrated systems for mobile devices and fast-growing business segments, such as Internet of Things (IoT), drones, robotics, automotive applications and more, under the name RF360 Holdings Singapore PTE.
The joint venture will draw upon TDK’s capabilities in micro-acoustic RF filtering, packaging and module integration technologies and Qualcomm Technologies, Inc.’s expertise in advanced wireless technologies to serve customers with RF solutions into fully-integrated systems.
