Nordson DAGE, a division of Nordson, has announced the launch of its Xi3400 Automated X-ray Inspection System (AXI) during NEPCON South China held in Shenzhen 26th – 28th August 2014.

This new Nordson DAGE AXI system offers complete inspection of solder joints and other critical hidden features found in electronic assemblies, PCBs and packaged semiconductors. Ideal for in-line or off-line operation, the Xi3400’s algorithms enable fast and reliable automated inspection and real-time monitoring of critical process information.

Joshua Petras, business director – Inspection Products, commented at the launch, “The Xi3400 integrates the automation software techniques developed at Nordson YESTECH with Nordson DAGE hardware technology. This new and improved AXI system expands the market leading capabilities of our test and inspection portfolio.”

Using the Nordson DAGE patented Digitial Tomosynthesis Technology the Xi3400 acquires multiple images in different slice heights in one inspection cycle. The images can discriminate between components on the top and bottom slices of double sided boards for unimpeded automated inspection.