Toshiba Electronics Europe announced the launch of JEDEC e•MMC Version 5.1 compliant embedded NAND flash memory products supporting “command queuing” and “secure write protection”. The new products integrate NAND chips fabricated with 15nm process technology with a controller to manage basic control functions for NAND applications in a single package. The devices are designed for application in a wide range of digital consumer products, including smartphones, tablets and wearable devices. Samples of the 16GB (THGBMHG7C2LBAIL) and 64GB (THGBMHG9C8LBAIG) products are now ready to ship, with 32GB (THGBMHG8C4LBAIR) and 128GB (THGBMHT0C8LBAIG) products to follow.
Demand continues to grow for NAND flash memory that can support applications such as smartphones and tablets. This is particularly true for embedded memories with a controller, which minimise development requirements and ease integration into system designs. Embedded in a system, the 128GB products can record up to 16.3 hours of full spec high definition video and 39.7 hours of standard definition video.
In October 2014, Toshiba launched the industry’s first e•MMC products supporting all mandatory features of JEDEC e•MMC Version 5.1, which was officially issued by JEDEC on February 24th, 2015. The new additions to the line-up support two optional features of e•MMC Version 5.1, “command queuing” and “secure write protection”.
The JEDEC e•MMC Version 5.1 compliant interface simplifies system development, allowing manufacturers to minimise development costs and speed up time to market for new and upgraded products. The devices handle all essential NAND memory management functions including wear-leveling, bad block management, garbage collection and error correction.
Additionally, new features standardised in JEDEC e•MMC Version 5.1, such as Background Operations (BKOPS) control, Cache Barrier, Cache Flushing Report and Large Replay Protected Memory Block (RPMB) Write, are applied to the new products to enhance usability.
The “command queuing feature” allows users to process multiple tasks generated by the user’s issue of multiple commands, in the order of the user’s preference, by initially storing the tasks in a waiting queue. It improves random read performance speed by approximately 30% at maximum compared to products without the “command queuing feature”. It effectively improves the user experience when simultaneously executing multiple applications on mobile devices, including smartphones and tablets.
The “secure write protection feature” expands the conventional write protect feature and protects the user’s important data stored in an assigned area from being overwritten or erased by unauthenticated users.
Available in a 153 ball FBGA package measuring 11.5mm x 13.0mm the memory devices feature an HS-MMC interface. They support an operating temperature range of -25oC to +85oC. core voltage range of 2.7V to 3.6V and interface voltage ranges of 1.7V to 1.95V and 2.7V to 3.6V.
