Farnell element14 has announced the launch of the Texas Instruments CC3200 Launchpad and CC3100 BoosterPack, a development platform and Wi-Fi device, created for faster and easier implementation of solutions for the Internet of Things(IoT).
The CC3200 LaunchPad kit is the industry’s first single-chip programmable microcontroller with built-in Wi-Fi connectivity suitable for applications in cloud connectivity, home automation, safety and security, health and fitness, and metering. It features on-board emulation using an FTDI device and has temperature sensors, a 3-axis accelerometer, LEDs and push-buttons.
This SimpleLink enabled wireless MCU, based on the high-performance ARM Cortex –M4 , enables developers to create an entire application with a single IC. It comes with driver support and an SDK with over 40 applications for Wi-Fi protocols, internet applications and MCU peripheral examples together with user guides, design files and API guides.
Add Wi-Fi to to an external host microcontroller with the CC3100 BoosterPack, a next-generation SimpleLink Wi-Fi device, for easy implementation of Internet connectivity including security, quick connection and cloud support. This simplifies the creation of IoT solutions with advantages such as reduced development time, lower costs, space-saving, ease of certification and less need for RF expertise. Moreover, it can run on two AA batteries for over a year which, for the first time, brings embedded Wi-Fi capabilities to battery-operated end-equipment.
In addition, an advanced emulation accessory board – CC31XXEMUBOOST – is available for flashing updates to the CC3100BOOST, using the radio tool for RF performance evaluation, and for advanced FTDI debugging.
The Texas Instruments CC3200 Launchpad and CC3100 Boosterpack are now available from Farnell element14 in Europe, priced at £17.78 and £11.85. Quality data sheets and application notes can be found on the product pages together with a range of associated accessories, and 24/5 live tech support is available for any queries.
David Shen, group chief technology officer at Premier Farnell said: “These new IoT solutions build upon TI’s connectivity leadership and are a significant addition to Premier Farnell’s comprehensive offering of low power IoT-enabling development tools from the world’s leading suppliers. Developers will value the integrated Wi-Fi solution which offers faster time to market, greater functionality, and drives down system costs and power consumption.”