harwin gecko wins ace award medium Gecko G125 Series connector wins 2014 ECN Impact Award for excellence in packaging and interconnectsHarwin, a manufacturer of hi-rel interconnect solutions and cost-saving PCB hardware products, has announced that its Gecko G125 high reliability, high performance 1.25mm pitch connector has won the ECN Impact Award 2014 for excellence in packaging and interconnects. Set up to recognise design engineering and innovation, as well as industry contributions to green technology and education, the Impact Awards from Electronic Component News were presented at a ceremony held during the recent Electronic Design Show in Las Vegas. 
 
Commented Doug Steele, Harwin’s VP global distribution: “We are absolutely delighted to receive the excellence in packaging and interconnects award from ECN. This is one of the broadest product categories in the ECN Awards, encompassing cables, terminal blocks, adhesives, shielding devices and other packaging and interconnect-related devices. This Award is the culmination of a good year for us, as it completes a trio of awards for the Gecko product line over the past few months, commencing with the Elektra Award for passive and electromechanical product of the year in the UK last November, followed by the EETimes/EDN ACE Award in the ultimate products – passives, interconnects and electromechanical category earlier this year.”
 
Gecko connectors provide a reliable, high performance, micro-miniature interconnect solution for cable and PCB applications. These low profile, dual row cable-to-board and board-to-board interconnects are suitable for stacking and cable mating, saving space where PCB real estate is at a premium. For high-rel applications where space and weight are critical, Gecko’s dense pin spacing of 1.25mm and up to 50 contacts per connector achieves a 35% space saving over other high-performance connectors such as Micro-D. Gecko offers performance for its size, with a current rating of 2A per contact simultaneously and contact resistance of 20mO. It withstands harsh environments, including shock, vibration and extreme temperatures, and has been selected for applications ranging from miniature satellites to medical devices.