AI Technology (AIT) has introduced a new generation of Flip-Chip Underfill solution that combines a High Tg of >240°C and novel stress absorbing capabilities to allow long-term reliability of large area flip-chip devices. MC7885-UFS is a proven underfill adhesive that fills under large area chips and cures without voids and internal stresses for ultimate reliability.
MC7885-UFS is a novel underfill paste that underfills large area flip-chip components to provide an excellent thermal interface allowing high power devices to dissipate heat to both sides of the package.
MC7885-UFS is designed for use in both chip-on-board underfill and standard flip-chip underfill component applications to reduce stress. MC7885-UFS can withstand temperatures up to 350ºC without thermal degradation. Its chemistry results in very low moisture absorption and high strength protection. The cured underfill has less than 20ppm/°C in coefficient of thermal expansion and higher than 6 GPa in modulus.
The differences and benefits between MC7885-UFS and traditional underfills include:
• More than 5 times higher thermal conductivity than that of traditional underfills
• Tg at >240°C in comparison to traditional underfills with a Tg around 140°C
• Tg close to lead-free soldering temperature reduces tensile and shear stress
• Proven additional stress protection with outstanding engineered molecular stress absorption without compromising performance by using low glass transition underfills
MC7885-UFS has an easy cure schedule. Most curing can be done at 120°C, or the operator can increase temperature to 150°C to cure in less time.
Please speak to one of our Application Engineers about sampling AI Technology’s MC7885-UFS and put it on the top of your testing list for your new generation of flip-chip devices.
