An audio/voice DSP IP core for SOC design has been developed by Tensilica Inc. The device features audio post-processing and voice processing algorithms used in smartphone and home entertainment systems.
The HiFi 3 audio/voice DSP is upwards software compatible with the HiFi 2 and HiFi EP audio/voice DSPs, so the existing library of over 90 HiFi-optimised audio and voice codecs, and audio enhancement software packages, will run on the new cores. They can support DTS-HD Master Audio for Blu-ray Disc in 233MHz.
Voice requirements in smartphones are significantly outpacing Moore’s Law and battery technology. While today’s narrow band voice codecs and basic noise suppression can be satisfied with about 200MHz of audio DSP horsepower, these requirements will exceed 600MHz in a few years with the widespread deployment of the AMR-WB (adaptive multi-rate wide band) voice codec, the Skype SILK super wideband codec for VoIP, improved noise suppression, and other pre-processing functions such as noise-dependent volume control applications.
Tensilica
